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| EPOCAP
14530A/2404B |
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| EPOCAP
14530A/2404B is a filled, medium viscosity, two component
system. This general purpose, room temperature cured potting
and encapsulating compound exhibits good electrical
properties and good thermal conductivity. It is recommended
for the potting of transformers, coils, resistors and other
electrical/electronic components. |
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| EPOCAP
15144 |
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| EPOCAP 15144 is a
room temperature cure, two component, general purpose
potting compound developed for low voltage applications such
as ballasts, starters and mercury switches. It has a
convenient mix ratio, extremely low exotherm and shrinkage.
This system also has good thermal shock resistance and long
work life. |
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| EPOCAP
19284 |
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| EPOCAP 19284 is a
filled, low viscosity, two component epoxy potting and
encapsulating system. This general purpose, room temperature
cure system exhibits excellent impregnation of tightly wound
coils and transformers. It has good thermal conductivity,
heat distortion temperature and is recommended for potting
and encapsulating small coils, transformers and other
electrical or electronic components. |
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| EPOCAP
19174 |
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| EPOCAP 19174 is a
two component, room temperature cure electrical potting and
encapsulating system with a long work life. This semi-rigid,
low viscosity system has excellent thermal shock resistance
and excellent impregnation properties. It is recommended for
potting tightly wound coils, transformers, time delay relays
and other low or medium voltage electrical or electronic
devices. The system is UL recognized for UL-94-VO flame
rating at 0.250". |
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| EPOCAP
16505 |
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| EPOCAP 16505 is a
filled, two component, room temperature cure general purpose
potting and encapsulating system. It is recommended for
potting low voltage devices such as transformers, coils,
switches, time delay relays, connectors and other electrical
or electronic components |
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