EPOCAP 43648-EPOCURE 50110

Description:
EPOCAP 43648/EPOCURE 50110 is a versatile two–component, low-viscosity, room temperature cure encapsulation system. The cured system displays excellent physical and electrical properties at ambient temperatures. The system is recommended for low voltage, low temperature applications.

Typical Uses:
General purpose potting and encapsulating. Rotted wood filler. Adhesive applications requiring room cure and very low viscosity. Thin film coating such as table/bar topping. Concrete filler/crack repair when graded sand is added.

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EPOCAP 46505- EPOCURE 50114

Description:
EPOCAP 46505/ EPOCURE 50114 is a filled, two–component, room temperature cure epoxy system. This system is designed for bonding and sealing filter media to metal end caps. It is also recommended for the potting and encapsulation of transformers, coils, switches, connectors and other electrical/electronic components. It displays excellent resistance to synthetic lubricants and motor oil..

Typical Uses:
It is recommended for potting low voltage devices such as transformers, coils, switches, time delay relays, connectors and other electrical or electronic components

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EPOCAP
49174-59174

Description:
EPOCAP 49174/59174 is a two–component, room temperature cure electrical potting and encapsulating system with a long work life. This semi–rigid, low viscosity system has excellent thermal shock resistance and excellent impregnation properties. It is recommended for potting tightly wound coils, transformers, time delay relays and other low or medium voltage electrical or electronic devices. The system is UL recognized for UL–94–VO flame rating at 0.250"..

Typical Uses:
It is recommended for potting tightly wound coils, transformers, time delay relays and other low or medium voltage electrical or electronic devices. The system is UL recognized for UL-94-VO flame rating at 0.250".

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EPOCAP
45137-55137
 

Description:
EPOCAP 45137/55137 is a room temperature cure, two-component, epoxy potting and encapsulating system. This system is UL recognized for Hazardous Locations under file TVLE2.E189694 for Class I, Groups A, B, C and D; Class II, Groups E, F, and G. It is a filled system and exhibits very low shrinkage. It also has good chemical resistance to various fuels and alcohol/fuel mixtures..

Typical Uses:
25137 is designed for potting low to medium voltage electrical components. The A filled component should be stirred or agitated without introducing excessive air before use to ensure that all fillers are properly dispersed. The best cured properties are obtained by ensuring accurate proportioning and thorough mixing. EPOCAP 25137 is excellent for producing void free castings by vacuum degassing for a few minutes after mixing and pouring.

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